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5-113 product description ordering information typical applications features functional block diagram rf micro devices, inc. 7628 thorndike road greensboro, nc 27409, usa tel (336) 664 1233 fax (336) 664 0454 http://www.rfmd.com optimum technology matching? applied si bjt gaas mesfet gaas hbt si bi-cmos sige hbt si cmos ingap/hbt gan hemt sige bi-cmos vcc2 lo hb p lo hb n lo lb p lo lb n mode c q sig p mode d q sig n vref gc dec gc rf out lb n gnd mode a vcc1 i sig p i sig n mode b 7 6 5 4 3 2 1 12 11 10 9 8 18 17 16 15 14 13 23 22 21 20 19 24 note: the die flag is the chip's main ground. +45 -45 div 2 +45 -45 flo x2 mode control and biasing power control rf out lb p rf out hb n rf out hb p rf out wb n rf out wb p RF2705 low noise, multi-mode, quad-band, quadrature modulator and pa driver ? edge/gsm (gsm850/900) handsets ? edge/gsm (dcs/pcs) handsets ? w-cdma handsets/data cards ? w-cdma/gsm/edge multimode handsets and data cards the RF2705 is a low noise, multi-mode, quad-band direct i/q to rf modulator and pa driver designed for handset applications where multiple modes of operation are required. frequency doublers, dividers and lo buffers are included to support a variety of lo generation options. dynamic power control is supported through a single analog input giving 90db of power control range for the w-cdma mode and 40db of power control in the other two modes. three sets of rf outputs are provided: high band and low band low noise edge/gmsk outputs, as well as one wideband w-cdma output. the device is designed for 2.7v to 3.3v operation, and is assembled in a plastic, 24-pin, 4mmx4mm qfn. ? w-cdma high/mid/low power modes ? quad-band direct quadrature modulator ? variable gain pa drivers ? gmsk bypass amplifiers ? lo frequency doubler and divider ? baseband filtering RF2705 low noise, multi-mode , quad-band, quadrature modulator and pa driver RF2705pcba-41xfully assembled evaluation board 0 rev a4 041026 4.00 4.00 -b- -a- 0.10 c 0.10 c 0.10 c 0.10 c 1.00 0.80 seating plane -c- 0.08 c 0.05 0.00 scale: none 0.10 c 2.45 +0.10 -0.10 2.45 +0.10 -0.10 0.50 typ 0.10 c ab m 0.30 0.18 typ 0.50 0.30 typ dimensions in mm. shaded lead is pin 1. package style: qfn, 24-pin, 4x4 9
5-114 RF2705 rev a4 041026 absolute maximum ratings parameter rating unit supply voltage -0.5 to 3.6 v storage temperature -40 to +150 c operating ambient temperature -40 to +85 c input voltage, any pin -0.5 to +3.6 v input power, any pin +5 dbm parameter specification unit condition min. typ. max. output performance with modulated baseband inputs low band edge 8psk mode (gsm850/gsm900) mode=low band f lo x1 (see control logic truth table for mode control settings) output power v cc =2.7v, t=+25c maximum output power with 8psk modulated signal* maximum vgc 0 +2.5 dbm while meeting spectral mask minimum vgc -39 -37 dbm while meeting spectral mask gain range 42 db difference between output power at gc=2.0v and gc=0.2v. out-of-band emission spectrum emission mask* frequency spacing 200khz -36 tbd dbc 30khz bw 250khz -43 tbd dbc 30khz bw 400khz -67 tbd dbc 30khz bw 600khz to 1800khz -73 dbc 30khz bw 1800khz to 3000khz -73 dbc 100khz bw 3000khz to 6000khz -73 dbc 100khz bw > 6000khz -75 dbc 100khz bw error vector magnitude 8psk modulation rms* 2 3 % origin offset* -40 -34 db peak* 4 9 % output noise at f c 20mhz* relative noise at: maximum gain -156 dbc/hz gc=2.0v, iq=1.2v p-p 8psk -152 dbc/hz gc=2.0v to 1.4v absolute noise at: maximum gain -156 dbm gc=2.0v, iq=0v p-p all gain settings -154 dbm iq=1.2v p-p 8psk general conditions local oscillator lo lb input frequency 824 915 mhz rf lb output frequency 824 915 mhz input power -6.0 0.0 +3.0 dbm iq baseband inputs 8psk iq level 1.2 v p-p input iq signal driven differentially and in quadrature. iq common mode 1.2 v input bandwidth 0.7 1.0 mhz baseband filter attenuation 20 db at 20mhz offset * not tested in production caution! esd sensitive device. rf micro devices believes the furnished information is correct and accurate at the time of this printing. however, rf micro devices reserves the right to make changes to its products without notice. rf micro devices does not assume responsibility for the use of the described product(s).
5-115 RF2705 rev a4 041026 parameter specification unit condition min. typ. max. output performance with modulated baseband inputs high band edge 8psk mode (dcs1800/pcs1900) mode=high band f lo x1 (see control logic truth table for mode control settings) output power v cc =2.7v, t=+25c maximum output power with 8psk modulated signal* maximum vgc -1 +1.5 dbm while meeting spectral mask minimum vgc -40 -38 dbm while meeting spectral mask gain range 42 db difference between output power at gc=2.0v and gc=0.2v. out-of-band emission spectrum emission mask* frequency spacing 200khz -36 tbd dbc 30khz bw 250khz -43 tbd dbc 30khz bw 400khz -67 tbd dbc 30khz bw 600khz to 1800khz -73 dbc 30khz bw 1800khz to 3000khz -73 dbc 100khz bw 3000khz to 6000khz -73 dbc 100khz bw > 6000khz -75 dbc 100khz bw error vector magnitude 8psk modulation rms* 1.3 3 % origin offset* -37 -30 db peak* 3 11 % output noise at f c 20mhz* relative noise at: maximum gain -154 dbc/hz gc=2.0v, iq=1.2v p-p 8psk -150 dbc/hz gc=2.0v to 1.4v absolute noise at: maximum gain -153 dbm gc=2.0v, iq=0v p-p all gain settings -151 dbm iq=1.2v p-p 8psk general conditions local oscillator lo hb input frequency 1710 1910 mhz rf hb output frequency 1710 1910 mhz input power -6.0 0.0 +3.0 dbm iq baseband inputs 8psk iq level 1.2 v p-p input iq signal driven differentially and in quadrature. iq common mode 1.2 v input bandwidth 0.7 1.0 mhz baseband filter attenuation 20 db at 20mhz offset * not tested in production
5-116 RF2705 rev a4 041026 parameter specification unit condition min. typ. max. output performance with modulated baseband inputs w-cdma mode mode=wideband f lo x2 (see control logic truth table for mode control settings) output power v cc =2.7v, t=+25c, while meeting 48dbc alcr maximum output power with w-cdma modulated signal* high power mode 3 6 dbm gc=2.0v medium power mode -4 -1 dbm gc=1.5v gain range difference between output power at gc=2.0v and gc=0.2v. high power mode 90 db gain step gain step when switching between power modes in either direction. high power to medium power 0.5 db gc=1.4v medium power to low power tbd db gc=tbd out-of-band emission adjacent channel leakage power ratio (alcr)* channel spacing 5mhz 50 dbc 3.84mhz relative to channel power 10mhz 65 dbc 3.84mhz relative to channel power error vector magnitude rms* 1.4 %rms 3gpp w-cdma output noise at f c 40mhz* -152 -146 dbc/hz gc=2.0v -146 dbc/hz gc=2.0v to 1.5v general conditions local oscillator lo lb input frequency 960 990 mhz rf wb output frequency 1920 1980 mhz input power -10.0 0.0 +3.0 dbm iq baseband inputs 3gpp w-cdma hqpsk, 1dpcch+1dpdch iq level 0.8 v p-p input iq signal driven differentially and in quadrature. iq common mode 1.2 v input bandwidth 8 11 mhz baseband filter attenuation 10 db at 40mhz offset * not tested in production
5-117 RF2705 rev a4 041026 parameter specification unit condition min. typ. max. output performance with cw baseband inputs wideband mode mode=wideband f lo x2 (see control logic truth table for mode control settings) vga and pa driver v cc =2.7v, t=+25c, lo=975mhz to 990mhz at -10dbm, iq=540mv p-p ** at 100khz, unless otherwise noted output power w-cdma modu- lated* 5 dbm gc=2.0v, iq=0.8v p-p at hqpsk output power cw 2 5 8 dbm gc=2.0v gain control voltage range 0.2 2.0 v gain control range 92 db difference between output power at gc=2.0v and gc=0.2v gain control slope 73 db/v calculated between gc=1.0v and 0.5v modulator sideband suppression -48 -30 dbc gc=2.0v, no i/q adjustment * -50 -30 dbc gc=1.5v, no i/q adjustment * -50 -30 dbc gc=1.0v, no i/q adjustment * -50 -30 dbc gc=0.5v, no i/q adjustment carrier suppression -42 -30 dbc gc=2.0v, no i/q adjustment -41 -30 dbc gc=1.5v, no i/q adjustment -38 -30 dbc gc=1.0v, no i/q adjustment -23 -10 dbc gc=0.5v, no i/q adjustment 3rd harmonic of modulation suppression at f c -3x300khz -55 -50 dbc gc=2.0v spurious outputs spurious output at integer multi- ples of flo lb* gc=2.0v, i/q=540mv p-p at 100khz flo lb -60.0 dbm flo lb leakage 4xflo lb -14.0 0 dbm second harmonic of carrier 6xflo lb -47.0 0 dbm third harmonic of carrier output compression output p1db* +11.5 dbm i/q=100khz intermodulation output ip3* +20 dbm gc=2.0v. extrapolated from im3 with two baseband tones at 90khz and 110khz applied differentially, in quadrature, at both i and q inputs, each tone 400mv p-p . intermodulation im3 tone at f c +70khz and f c +130khz relative to tones at f c +90khz and f c +110khz -37 dbc gc=2.0v -40 dbc gc=1.5v * not tested in production ** provides the same output power as modulated signal with associated crest factor.
5-118 RF2705 rev a4 041026 parameter specification unit condition min. typ. max. output performance with cw baseband inputs low band mode (gsm850/gsm900) mode=low band f lo x1 (see control logic truth table for mode control settings) vga and pa driver v cc =2.7v, t=+25c, lo=824mhz to 915mhz at 0dbm, iq=800mv p-p ** at 100khz, unless otherwise noted output power 8psk modulated* +2.5 dbm gc=2.0v, iq=1.2v p-p 8psk output power cw 0 2.2 +5 dbm gc=2.0v, iq=800mv p-p at 100khz -1.2 dbm gc=1.5v, iq=800mv p-p at 100khz * -13.5 dbm gc=1.0v, iq=800mv p-p at 100khz -30 dbm gc=0.5v, iq=800mv p-p at 100khz -44 -40 -37 dbm gc=0.2v, iq=800mv p-p at 100khz gain control voltage range 0.2 2.0 v gain control range 42 db difference between output power at gc=2.0v and gc=0.2v gain control slope 28 db/v calculated between gc=0.5v and 1.5v modulator sideband suppression -36 -30 dbc gc=2.0v, no i/q adjustment * -36 -30 dbc gc=1.5v, no i/q adjustment * -36 -30 dbc gc=1.0v, no i/q adjustment * -36 -30 dbc gc=0.5v, no i/q adjustment * -36 -30 dbc gc=0.2v, no i/q adjustment carrier suppression -44 -34 dbc gc=2.0v, no i/q adjustment -44 -34 dbc gc=1.5v, no i/q adjustment * -44 -34 dbc gc=1.0v, no i/q adjustment -44 -34 dbc gc=0.5v, no i/q adjustment -40 -34 dbc gc=0.2v, no i/q adjustment 3rd harmonic of modulation suppression at f c -3x300khz -49 -40 dbc gc=2.0v spurious outputs f lo /2 mode spurious outputs at integer harmonics of 1/2xflohb* gc=2.0v, i/q=800mv p-p at 100khz flo hb -62.0 dbm second harmonic of carrier and lo leakage (3/2)xflo lb -19.0 dbm third harmonic of carrier output compression output p1db* +7.0 dbm i/q=100khz * not tested in production ** provides the same output power as modulated signal with associated crest factor.
5-119 RF2705 rev a4 041026 parameter specification unit condition min. typ. max. output performance with cw baseband inputs low band mode (gsm850/gsm900), cont?d mode=low band f lo x1 (see control logic truth table for mode control settings) intermodulation output ip3* +20.0 dbm gc=2.0v. extrapolated from im3 with two baseband tones at 90khz and 110khz applied differentially, in quadrature, at both i and q inputs, each tone 400mv p-p . intermodulation im3 tone at f c +70khz and f c +130khz relative to tones at f c +90khz and f c +110khz -48 dbc gc=2.0v low band bypass mode (gsm850/gsm900) mode=low band bypass (see control logic truth table for mode control settings) pa d ri ve r v cc =2.7v gmsk input power* -3 0 +3 dbm at lo lb input from a 50 ? source. gmsk output power 5.0 7.5 10.0 dbm at rf lb output output impedance* 50 ? output noise at f c 20mhz* -161 -159 dbc/hz am+pm noise, lo=0dbm * not tested in production
5-120 RF2705 rev a4 041026 parameter specification unit condition min. typ. max. output performance with cw baseband inputs high band mode (dcs1800/pcs1900) mode=high band f lo x1 (see control logic truth table for mode control settings) vga and pa driver v cc =2.7v, t=+25c, lo=1710mhz to 1910mhz at 0dbm, iq=800mv p-p ** at 100khz, unless otherwise noted output power 8psk modulated* 0 2.2 dbm gc=2.0v, iq=1.2v p-p 8psk output power cw 0 2 +6.0 dbm gc=2.0v, iq=800mv p-p at 100khz -1.6 dbm gc=1.5v, iq=800mv p-p at 100khz * -17.6 dbm gc=1.0v, iq=800mv p-p at 100khz -30 dbm gc=0.5v, iq=800mv p-p at 100khz -44 -40 -37 dbm gc=0.2v, iq=800mv p-p at 100khz gain control voltage range 0.2 2.0 v gain control range 42 db difference between output power at gc=2.0v and gc=0.2v gain control slope 28 db/v calculated between gc=0.5v and 1.5v modulator sideband suppression -45 -30 dbc gc=2.0v, no i/q adjustment * -45 -30 dbc gc=1.5v, no i/q adjustment * -45 -30 dbc gc=1.0v, no i/q adjustment * -45 -30 dbc gc=0.5v, no i/q adjustment * -45 -30 dbc gc=0.2v, no i/q adjustment carrier suppression -40 -34 dbc gc=2.0v, no i/q adjustment -40 -34 dbc gc=1.5v, no i/q adjustment * -40 -33 dbc gc=1.0v, no i/q adjustment -39 -30 dbc gc=0.5v, no i/q adjustment -37 -30 dbc gc=0.2v, no i/q adjustment 3rd harmonic of modulation suppression at f c -3x300khz -50 -40 dbc gc=2.0v spurious outputs f lo x2 mode spurious outputs at integer harmonics of 1/2xflohb gc=2.0v, i/q=800mv p-p at 100khz flo lb -70.0 dbm flo lb leakage 4xflo lb -25.0 dbm second harmonic of carrier 6xflo lb -40.0 dbm third harmonic of carrier output compression output p1db* +8.0 dbm i/q=100khz * not tested in production ** provides the same output power as modulated signal with associated crest factor.
5-121 RF2705 rev a4 041026 parameter specification unit condition min. typ. max. output performance with cw baseband inputs high band mode (dcs1800/pcs1900), cont?d mode=high band f lo x1 (see control logic truth table for mode control settings) intermodulation output ip3* +20 dbm gc=2.0v. extrapolated from im3 with two baseband tones at 90khz and 110khz applied differentially, in quadrature, at both i and q inputs, each tone 400mv p-p . intermodulation im3 tone at f c +70khz and f c +130khz relative to tones at f c +90khz and f c +110khz -53 -42 dbc gc=2.0v output performance with cw baseband inputs wideband mode mode=wideband f lo x2 (see control logic truth table for mode control settings) vga and pa driver v cc =2.7v, t=+25c, lo=975mhz to 990mhz at -10dbm, iq=540mv p-p ** at 100khz, unless otherwise noted output power w-cdma modu- lated* 5 dbm gc=2.0v, iq=0.8v p-p at hqpsk output power cw 2 5 8 dbm gc=2.0v gain control voltage range 0.2 2.0 v gain control range 92 db difference between output power at gc=2.0v and gc=0.2v gain control slope 73 db/v calculated between gc=1.0v and 0.5v modulator sideband suppression -48 -30 dbc gc=2.0v, no i/q adjustment * -50 -30 dbc gc=1.5v, no i/q adjustment * -50 -30 dbc gc=1.0v, no i/q adjustment * -50 -30 dbc gc=0.5v, no i/q adjustment carrier suppression -42 -30 dbc gc=2.0v, no i/q adjustment -41 -30 dbc gc=1.5v, no i/q adjustment -38 -30 dbc gc=1.0v, no i/q adjustment -23 -10 dbc gc=0.5v, no i/q adjustment 3rd harmonic of modulation suppression at f c -3x300khz -55 -50 dbc gc=2.0v spurious outputs spurious output at integer multi- ples of flo lb* gc=2.0v, i/q=540mv p-p at 100khz flo lb -60.0 dbm flo lb leakage 4xflo lb -14.0 0 dbm second harmonic of carrier 6xflo lb -47.0 0 dbm third harmonic of carrier output compression output p1db* +11.5 dbm i/q=100khz intermodulation output ip3* +20 dbm gc=2.0v. extrapolated from im3 with two baseband tones at 90khz and 110khz applied differentially, in quadrature, at both i and q inputs, each tone 400mv p-p . intermodulation im3 tone at f c +70khz and f c +130khz relative to tones at f c +90khz and f c +110khz -37 dbc gc=2.0v -40 dbc gc=1.5v * not tested in production ** provides the same output power as modulated signal with associated crest factor.
5-122 RF2705 rev a4 041026 parameter specification unit condition min. typ. max. high band bypass mode (dcs1800/pcs1900) mode=high band bypass (see control logic truth table for mode control settings) pa d ri ve r v cc =2.7v gmsk input power* -3 0 +3 dbm at lo lb input from a 50 ? source. gmsk output power 4.0 6.8 9.0 dbm at rf lb output output impedance* 50 ? output noise at f c 20mhz* -161 -159 dbc/hz am+pm noise, lo=0dbm * not tested in production
5-123 RF2705 rev a4 041026 parameter specification unit condition min. typ. max. general specifications operating range supply voltage 2.7 3.3 v temperature -40 +85 c current consumption refer to logic control truth table for mode control pin voltages. sleep <1 10 a wideband f lo x1 (high power) 114 ma gc=2.0v *85 magc=0.2v (medium power) 89 ma gc=2.0v *54 magc=0.2v (low power) 63 ma gc=2.0v. see note 1. * 42 ma gc=0.2v. see note 1. wideband f lo x2 (high power) 110 ma gc=2.0v 84 ma gc=0.2v (medium power) 80 ma gc=2.0v 53 ma gc=0.2v (low power) 54 ma gc=2.0v. see note 1. 41 ma gc=0.2v. see note 1. high band f lo x2 72 ma gc=2.0v low band f lo /2 82 ma gc=2.0v high band bypass 23 ma low band bypass 22 ma high band f lo x1 76 ma gc=2.0v low band f lo x1 74 ma gc=2.0v logic levels input logic 0 0 0.4 v input logic 1 1.4 v cc v logic pins input current <1.0 acmos inputs lo input ports lo lb input frequency range 800 1000 mhz lo hb input frequency range 1600 2000 mhz input impedance 50 ? externally matched i/q baseband inputs baseband input voltage 1.15 1.25 v common mode voltage baseband input level edge 1.2 v p-p differential w-cdma 0.8 v p-p 1dpcch+1dpdch. see note 1. gmsk 1.0 v p-p differential baseband input impedance 100k||1pf ? measured at 100khz input bandwidth edge 0.7 1.0 mhz w-cdma 8.0 11.0 mhz baseband filter attenuation edge 20 db at 20mhz w-cdma 10 db at 40mhz baseband input dc current -10 0 10 a gain control gain control voltage 0.2 2.2 v gain control impedance 10 k ? note 1: in low power mode it is recommended that the iq level be reduced to 0.4v p-p . if iq level is >0.4v p-p , this mode should be used for w-cdma tx power levels belo w -20dbm (measured at antenna).
5-124 RF2705 rev a4 041026 pin function description interface schematic 1vcc2 supply for lo buffers, frequency doubler and dividers. 2lo hb p high band local oscillator input (1800mhz). in ?low band f lo /2? modes the signal (lohbp-lohbn) undergoes a frequency division of 2 to provide the low band lo signal for the modu- lator. in ?high band f lo x1? modes the signal (lohbp-lohbn) is used as the high band lo signal for the modulator. in ?high band bypass? a modulated dcs1800/pcs1900 signal (lohbp-lohbn) is switched into the rf signal path. the modulator is disabled and the signal is routed to the rfouthb outputs through a differential pa driver amplifier. the lohbp input is ac-coupled internally. the noise performance, carrier suppression at low output powers and sideband suppression all vary with lo power. the optimum lo power is between -3dbm and +3dbm. the device will work with lo powers as low as -20dbm however this is at the expense of higher phase noise in the lo circuitry and poorer sideband suppression. the input impedance should be externally matched to 50 ? . the port can be driven either differentially or single ended. the port impedance does not vary significantly between active and power down modes. the RF2705 is intended for use with the rf6002. this performs the gsm gmsk modulation within a frac-n synthesizer loop. the 8psk edge and w-cdma signal modulations are performed in the RF2705 and uses the rf6002?s synthesizers to generate the lo signals. the lo signal for edge900 mode is derived by frequency division by 2 of the rf6002?s dcs1800 vco. this helps protect the system against pa pulling. 3lo hb n the complementary lo input for both lohbp lo signals. in any of the modes the lohb input may be driven either single ended or differentially. if the lo is driven single ended then the pcb board designer can ground this pin. it is recommended that if this pin is grounded that it is kept isolated from the gnd1 pin and the die flag ground. all connections to any other ground should be made through a ground plane. poor routing of this ground signal can significantly degrade the lo leakage performance. see pin 2. modulator and vga vcc2 lo hb p lo hb n v cc
5-125 RF2705 rev a4 041026 pin function description interface schematic 4lo lb p low band local oscillator input (900mhz). in ?wideband f lo x2? and ?high band f lo x2? modes the signal (lolbp-lolbn) is doubled in frequency to provide the lo signal for the modulator. in ?low band f lo x1? modes the signal (lolbp-lolbn) is used as the lo signal for the modulator. in ?low band bypass? a modulated gsm900 signal (lolbp-lolbn) is switched into the rf signal path. the modulator is disabled and the signal is routed to the rfoutlb outputs through a differential pa driver amplifier. this lolbp input is ac-coupled internally. the noise performance, carrier suppression at low output powers and sideband suppression performance are functions of lo power. the optimum lo power is between -3dbm and +3dbm. the device will work with lo powers as low as -20dbm however this is at the expense of higher noise performance at high output powers and poorer side- band suppression. the input impedance should be externally matched to 50 ? . the port impedance does not vary significantly between active and powered modes. the RF2705 is intended for use with the rf6002 which performs the gsm gmsk modulation within a frac-n synthesizer loop. the 8psk edge and w-cdma signal modulations are performed in the RF2705 and uses the rf6002?s synthesizers to generate the lo signals. the lo signal for dcs1800 mode is derived by frequency doubling rf6002?s gsm900 vco. this helps protect the system against pa pull- ing. 5lo lb n the complementary lo input for both lolbp lo signals. in any of the modes the lolb input may be driven either single ended or differentially. if the lo is driven single ended then the pcb board designer can ground this pin. it is recommended that if this pin is grounded that it is kept isolated from the gnd1 pin and the die flag ground. all connections to any other ground should be made through a ground plane. poor routing of this gndlo signal can significantly degrade the lo leakage performance. see pin 4. 6mode c chip enable control pin. see the logic truth table. cmos logic inputs: logic 0=0v to 0.4v; logic 1=1.4v to v cc . 7mode d mode control pin. see the logic truth table. cmos logic inputs: logic 0=0v to 0.4v; logic 1=1.4v to v cc . see pin 6. lo lb p lo lb n v cc v cc2
5-126 RF2705 rev a4 041026 pin function description interface schematic 8q sig n quadrature q channel negative baseband input port. best performance is achieved when the qsigp and qsign are driven differentially with a 1.2v common mode dc voltage. the recom- mended differential drive level (v qsigp -v qsign ) is 1.2v p-p for edge, 0.8v p-p for w-cdma modulation and 1.0v p-p for gmsk modulation. this input should be dc-biased at 1.2v. in sleep mode an internal fet switch is opened, the input goes high impedance and the modulator is de-biased. phase or amplitude errors between the qsigp and qsign signals will result in a common-mode signal which may result in an increase in the even order distortion of the modulation in the output spectrum. dc offsets between the qsigp and qsign signals will result in increased carrier leakage. small dc offsets may be deliberately applied between the isigp/isign and qsigp/qsign inputs to can- cel out the lo leakage. the optimum corrective dc offsets will change with mode, frequency and gain control. common-mode noise on the qsigp and qsign should be kept low as it may degrade the noise performance of the modulator. phase offsets from quadrature between the i and q baseband signals results in degraded sideband suppression. 9q sig p quadrature q channel negative baseband input port. see pin 8. see pin 8. 10 vref voltage reference decouple. external 10nf decoupling capacitor to ground. the voltage on this pin is typically 1.67v when the chip is enabled. the voltage is 0v when the chip is powered down. the purpose of this decoupling capacitor is to filter out low frequency noise (20mhz) on the gain control lines. poor positioning of the vref decoupling capacitor can cause a degra- dation in lo leakage. a voltage of around 2.5v on this pin indicates that the die flag under the chip is not grounded and the chip is not biased correctly. 11 gc dec gain control voltage decouple with an external 1nf decoupling capaci- tor to ground. the voltage on this pin is a function of gain control (gc) voltage when the chip is enabled. the voltage is 0v when the chip is powered down. the purpose of this decoupling capacitor is to filter out low frequency noise (20mhz) on the gain control lines. the size capacitor on the gc dec line will effect the settling time response to a step in gain control voltage. a 1nf capacitor equates to around 200ns settling time and a 0.5nf capacitor equates to a 100ns settling time. there is a trade-off between settling time and noise contributions by the gain control cir- cuitry as gain control is applied. poor positioning of the vref decoupling capacitor can cause a degra- dation in lo leakage. 12 gc gain control voltage. maximum output power at 2.0v. minimum output power at 0v. when the chip is enabled the input impedance is 10k ? to 1.67v dc . when the chip is powered down a fet switch is opened and the input goes high impedance. v cc2 x1 v cc2 - + 4 k ? v cc2 - + 4 k ? v cc2 - + 4 k ? 10 k ? 1.7 v
5-127 RF2705 rev a4 041026 pin function description interface schematic 13 rf out lb n differential low band pa driver amplifier output. this output is intended for low band (gsm850/900) operation and drives a differential saw. a bypass mode allows the low band pa driver amplifier?s input to be switched between the signal from the modulator and the signal applied at lolb. this enables a gmsk-modulated signal on the lolb input to be switched into the rf signal path. the output is an open collector. the outputs are matched off-chip. 14 rf out lb p complementary differential low band pa driver amplifier output. see pin 13. see pin 13. 15 rf out hb n differential high band pa driver amplifier output. this output is intended for dcs1800/pcs1900 band operation. a bypass mode allows the high band pa driver amplifier?s input to be switched between the signal from the modulator and the signal applied at lohb. this enables a gmsk-modulated dcs1800/pcs1900 signal on the lohb input to be switched into the rf signal path. the output is an open collector. the outputs are matched off-chip. 16 rf out hb p complementary differential high band pa driver amplifier output. see pin 15. see pin 15. 17 rf out wb n differential high band pa driver amplifier output. this output is intended for wide band (w-cdma) applications. the output is an open collector. the output are matched off-chip. 18 rf out wb p complementary differential wideband pa driver amplifier output. see pin 17. see pin 17. 19 gnd ground. 20 mode a mode control pin. see the logic truth table. cmos logic inputs: logic 0=0v to 0.4v; logic 1=1.4v to v cc . see pin 6. 21 vcc1 supply for modulator, vga and pa driver amplifiers. v cc v cc rf out lb n rf out lb p v cc v cc v cc rf out hb n rf out hb p v cc v cc v cc rf out wb n rf out wb p v cc lo quadrature generator and buffers vcc1 gnd1
5-128 RF2705 rev a4 041026 pin function description interface schematic 22 i sig p in-phase i channel positive baseband input port. best performance is achieved when the isigp and isign are driven differentially with a 1.2v common mode dc voltage. the recom- mended differential drive level (v isigp -v isign ) is 1.2v p-p for edge, 0.8v p-p w-cdma modulation and 1.0v p-p for gmsk modulation. this input should be dc-biased at 1.2v. in sleep mode an internal fet switch is opened, the input goes high impedance and the modulator is de-biased. phase or amplitude errors between the isigp and isign signals will result in a common-mode signal which may result in an increase in the even order distortion of the modulation in the output spectrum. dc offsets between the isigp and isign signals will result in increased carrier leakage. small dc offsets may be deliberately applied between the isigp/isign and qsigp/qsign inputs to can- cel out the lo leakage. the optimum corrective dc offsets will change with mode, frequency and gain control. common-mode noise on the isigp and isign should be kept low as it may degrade the noise performance of the modulator. phase offsets from quadrature between the i and q baseband signals results in degrades sideband suppression. 23 i sig n in-phase i channel negative baseband input port. see pin 22. see pin 22. 24 mode b mode control pin. see the logic truth table. cmos logic inputs: logic 0=0v to 0.4v; logic 1=1.4v to v cc . see pin 6. pkg base die flag ground for lo section, modular, biasing, variable gain amplifier, and substrate. v cc2 x1
5-129 RF2705 rev a4 041026 lo frequency planning options for european 3gpp w-cdma/edge recommended frequency plan: frequency doubler/divide by 2/gmsk modulator bypass modes on frequency lo with gmsk modulator bypass modes output frequency band modulation format lo port lo frequency range comments band lower limit upper limi t lower limit upper limit gsm850 824mhz 849mhz edge 8psk lohb 1648mhz 1698mhz f lo /2 divide by 2 gsm850 824mhz 849mhz gsm gmsk lolb 824mhz 849mhz f lo _bypass bypass, gmsk-modulated lo gsm900 880mhz 915mhz edge 8psk lohb 1760mhz 1830mhz f lo /2 divide by 2 gsm900 880mhz 915mhz gsm gmsk lolb 880mhz 915mhz f lo _bypass bypass, gmsk-modulated lo dcs1800 1710mhz 1785mhz edge 8psk lolb 855mhz 892.5mhz f lo x2 frequency doubler dcs1800 1710mhz 1785mhz gsm gmsk lohb 1710mhz 1785mhz f lo _bypass bypass, gmsk-modulated lo pcs1900 1850mhz 1910mhz edge 8psk lolb 925mhz 955mhz f lo x2 frequency doubler pcs1900 1850mhz 1910mhz gsm gmsk lohb 1850mhz 1910mhz f lo _bypass bypass, gmsk-modulated lo w-cdma1950 1920mhz 1980mhz 3gpp w-cdma lolb 960mhz 990mhz f lo x2 frequency doubler output frequency band modulation format lo port lo frequency range comments band lower limit upper limi t lower limit upper limit gsm850 824mhz 849mhz edge 8psk lolb 824mhz 849mhz f lo x1 on frequency gsm850 824mhz 849mhz gsm gmsk lolb 824mhz 849mhz f lo _bypass bypass, gmsk-modulated lo gsm900 880mhz 915mhz edge 8psk lolb 880mhz 915mhz f lo x1 on frequency gsm900 880mhz 915mhz gsm gmsk lolb 880mhz 915mhz f lo _bypass bypass, gmsk-modulated lo dcs1800 1710mhz 1785mhz edge 8psk lohb 1710mhz 1785mhz f lo x1 on frequency dcs1800 1710mhz 1785mhz gsm gmsk lohb 1710mhz 1785mhz f lo _bypass bypass, gmsk-modulated lo pcs1900 1850mhz 1910mhz edge 8psk lohb 1850mhz 1910mhz f lo x1 on frequency pcs1900 1850mhz 1910mhz gsm gmsk lohb 1850mhz 1910mhz f lo _bypass bypass, gmsk-modulated lo w-cdma1950 1920mhz 1980mhz 3gpp w-cdma lohb 1920mhz 1980mhz f lo x1 on frequency
5-130 RF2705 rev a4 041026 control logic truth table mode description input logic active rf i/os comment mode a mode b mode c mode d expected mode of operation sleep mode sleep x000 sleep frequency doubler/divide by 2 options wideband f lo x2 (high power) modulator and frequency doubler enabled 1 0 1 0 lolbp lolbn rfoutwb p rfoutwb n bands: 1920mhz to 1980mhz modulation: 3gpp w-cdma wideband f lo x2 (medium power) modulator and frequency doubler enabled 1 0 1 1 lolbp lolbn rfoutwb p rfoutwb n bands: 1920mhz to 1980mhz modulation: 3gpp w-cdma wideband f lo x2 (low power) modulator and frequency doubler enabled 1 0 0 1 lolbp lolbn rfoutwb p rfoutwb n bands: 1920mhz to 1980mhz modulation: 3gpp w-cdma high band f lo x2 modulator and frequency doubler enabled 1 1 1 1 lolbp lolbn rfouthb p rfouthb n bands: dcs1800 or pcs1900 modulation: gmsk, tdma and 8psk edge low band f lo /2 modulator and divide by 2 enabled 1101lohbp lohbn rfoutlb p rfoutlb n bands: gsm900 or gsm850 modulation: gmsk, tdma and 8psk edge gmsk modulator bypass options low band bypass modulator bypass enabled x 1 0 0 lolbp lolbn rfoutlb p rfoutlb n bands: gsm850 or gsm900 modulation: gmsk high band bypass modulator bypass enabled x 1 1 0 lohbp lohbn rfouthb p rfouthb n bands: dcs1800 or pcs1900 modulation: gmsk on-frequency lo options wideband f lo x1 (high power) modulator and on-frequency lo enabled 0010lohbp lohbn rfoutwb p rfoutwb n bands: 1920mhz to 1980mhz modulation: 3gpp w-cdma wideband f lo x1 (medium power) modulator and on-frequency lo enabled 0011lohbp lohbn rfoutwb p rfoutwb n bands: 1920mhz to 1980mhz modulation: 3gpp w-cdma wideband f lo x1 (low power) modulator and on-frequency lo enabled 0001lohbp lohbn rfoutwb p rfoutwb n bands: 1920mhz to 1980mhz modulation: 3gpp w-cdma high band f lo x1 modulator and on-frequency lo enabled 0111lohbp lohbn rfouthb p rfouthb n bands: dcs1800 or pcs1900 modulation: gmsk, tdma and 8psk edge low band f lo x1 modulator and on-frequency lo enabled 0 1 0 1 lolbp lolbn rfoutlb p rfoutlb n bands: gsm900 to gsm850 modulation: gmsk, tdma and 8psk edge
5-131 RF2705 rev a4 041026 application information the baseband inputs of the RF2705 must be driven with balanced signals. amplitude and phase matching <0.5db and <0.5 degrees are recomme nded. phase or ga in imbalances between the complement ary input signals will cause addi- tional distortion including some second order baseband distortion. the RF2705 is designed to be driven with either single-ended or differential lo signals. driving the chip differentially is beneficial in improv ing the lo leakage performa nce. decreasing the lo drive level w ill also improve lo leakage, but the output noise performance will be degraded. driving the lo level too high will degrade linearity. the ground lines for the lo sections are brought out of the chip independently from the ground to the rf and modulator sections. this is intended to give the board design the independence of isolating the lo signals from the rf output sec- tions. the RF2705 includes frequency doubler and divider modes that allow the lo to operate at half or twice the frequency depending on the application. this provides some flexib ility in improving vco isolatio n and lo leakage through fre- quency translation. the rf outputs use open collector architecture and may be biased at voltages higher than v cc . in practice, biasing at a higher voltage may improve the intermodulation performance. th e load resistors are selected to provide sufficient output power while maintaining good linearity. the gc dec and v ref output pins should be decoupled to ground. a 10nf capacitor on v ref and a 1nf capacitor on gc cec are recommended. the purpose of these capacitors is to filter out low frequency noise (20mhz) in the gain control lines that may ca use noise on the rf signal. the ca pacitor on the gc dec line will effect the settling time of the step response in power control voltage. a 1nf capacitor equates to around a 200ns settling time; a 0.5nf capacitor equates to a 100ns settling time. there is a trade-off between setting time and phase noise as gain control is applied. as with any rf circuit, the RF2705 is sensitive to pc board layout. the suggested schematic and board layout is included as a guideline. proper grounding of the die flag under the chip is essential in achieving acceptable rf perfor- mance. a symmetric output stru cture will maintain signal ba lance while keeping the rf lin es short will re duce losses. proper routing and bypassing of the supply lines will improve stability and performance, espe cially under low gain control settings where carrier suppression becomes crucial. the location and value of the bypass capacitor on pin 1 is critical in promoting good carrier suppression and is designated to resonate out the series wire bond and pc board inductance.
5-132 RF2705 rev a4 041026 application schematic 7 6 5 4 3 2 1 12 11 10 9 8 18 17 16 15 14 13 23 22 21 20 19 24 note: the die flag is the chip's main ground. +45 -45 div 2 +45 -45 flo x2 mode control and biasing power control 5.6 pf v cc 3.9 nh lo hb 3 pf 22.0 nh lo lb mode c mode d q sig n q sig p gc 10 nf 1 nf mode b i sig n i sig p 1 nf v cc 12 nh 3.3 pf v cc 0.5 pf 1 k ? 3.3 pf 12 nh rf out lb 4.3 nh 1.6 pf v cc 430 ? 1.6 pf v cc rf out hb 4.3 pf v cc 1 pf 1 k ? 4.3 pf 2.2 nh rf out wb mode a v cc v cc 1.8 pf 2:1 t3 2:1 t1 2:1 t2 430 ? 4.3 nh 2.2 nh
5-133 RF2705 rev a4 041026 evaluation board schematic 7 6 5 4 3 2 1 12 11 10 9 8 18 17 16 15 14 13 23 22 21 20 19 24 note: the die flag is the chip's main ground. +45 -45 div 2 +45 -45 flo x2 mode control and biasing power control c6 5.6 pf mode b mode a c1 1 nf vcc 50 ? strip j1 i sig n 50 ? strip j2 i sig p c4 1.8 pf l1 3.9 nh 50 ? strip j3 hb lo c13 3 pf l6 22 nh 50 ? strip j6 lb lo mode c mode d 50 ? strip j8 q sig n 50 ? strip j9 q sig p c15 1 nf c14 10 nf p1 1 2 3 4 con4 p2-1 mode d p2-4 mode a p2-3 mode b p2-2 mode c gc l7 12 nh c17 3.3 pf r4 1 k ? l8 12 nh c16 3.3 pf c8 100 pf c18 0.5 pf vcc 50 ? strip j7 lb rf out l4 4.3 nh c9 1.6 pf r3 430 ? l5 4.3 nh c10 1.6 pf c11 22 pf c5 dni vcc 50 ? strip j5 hb rf out l2 2.2 nh c2 4.3 pf r1 1 k ? l3 2.2 nh c3 4.3 pf c7 12 pf c12 1.3 pf vcc 50 ? strip j4 wb rf out in in gnd gnd gnd out t2 murata ldb211g8020c-001 43 5 1 6 2 t1 murata ldb211g9020c-001 2 5 6 4 3 1 in in gnd gnd gnd out in in gnd gnd gnd out t3 murata ldb21906m20c-001 43 5 1 6 2 r2 430 ? gnd vcc p1-1 gc p1-3 p2 1 2 3 con3
5-134 RF2705 rev a4 041026 evaluation board layout board size 2.250? x 2.250? board thickness 0.032?, board material fr-4, multi-layer assembly top mid back
5-135 RF2705 rev a4 041026 pcb design requirements pcb surface finish the pcb surface finish used for rfmd?s qualification process is electroless nickel, immersion gold. typical thickness is 3 inch to 8 inch gold over 180 inch nickel. pcb land pattern recommendation pcb land patterns are based on ipc-sm-782 standards when possible. the pad pattern shown has been developed and tested for optimized assembly at rfmd; however, it may require some modifications to address company specific assembly processes. the pcb land pattern has been developed to accommodate lead and package tolerances. pcb metal land pattern a = 0.69 x 0.28 (mm) typ. b = 0.28 x 0.69 (mm) typ. c = 2.50 (mm) sq. 0.50 (mm) typ. 0.50 (mm) typ. 2.50 (mm) typ. 0.57 (mm) typ. 1.25 (mm) typ. 0.57 (mm) typ. 2.50 (mm) typ. 1.25 (mm) typ. pin 1 pin 12 pin 18 pin 24 b b b b b b c a a a a a a a a a a a a b b b b b b figure 1. pcb metal land pattern (top view)
5-136 RF2705 rev a4 041026 pcb solder mask pattern liquid photo-imageable (lpi) solder mask is recommended. th e solder mask footprint will match what is shown for the pcb metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. the center-grounding pad shall also have a solder mask clearance. expansion of the pads to create solder mask clearance can be provided in the master data or requested from the pcb fabrication supplier. thermal pad and via design the pcb land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. thermal vias are required in the pcb layout to effectively conduct heat away from the package. the via pattern shown has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommo- dating routing strategies. the via pattern used for the rfmd qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. if micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. 0.50 (mm) typ. 0.50 (mm) typ. 2.50 (mm) typ. 0.57 (mm) typ. 1.25 (mm) typ. 0.57 (mm) typ. 2.50 (mm) typ. 1.25 (mm) typ. pin 1 pin 12 pin 18 pin 24 b b b b b b c a a a a a a a a a a a a b b b b b b a = 0.79 x 0.38 (mm) typ. b = 0.38 x 0.79 (mm) typ. c = 2.60 (mm) sq. figure 2. pcb solder mask pattern (top view)

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